VIDEO
Cadence’s AuraStack AI Super Agent delivers agentic AI platform for PCB and advanced packaging
Video Summary
Phil Bishop, VP of Corporate Marketing, Global Customer Success Team at Cadence, explains that, as hyperscale data centres deploy massive AI clusters and other industries advance increasingly intelligent, high-performance systems, engineering teams face growing complexity in PCB and advanced package design. Agentic AI orchestration, combined with trusted EDA and SDA tools, enables customers to move from manual iteration to intelligent, automated design realisation.
